Wire Bonding Market Future Demand Analysis With CAGR of 2.9% | TMR

Wire Bonding Market: Introduction

Transparency Market Research delivers key insights on the global wire bonding market. In terms of revenue, the global wire bonding market is estimated to expand at a CAGR of 2.9% during the forecast period, owing to numerous factors, regarding which TMR offers thorough insights and forecasts in its report on the global wire bonding market.

The global wire bonding market is broadly affected by several factors, including increasing demand for modern methods such as thermosonic and ultrasonic wire bonding.

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Wire Bonding Market: Dynamics

Wire bonding is the process of creating electrical interconnections between semiconductors or other integrated circuits and silicon chips using bonding wires, which are fine wires made of materials such as gold and aluminum. This process is categorized as welding process with solid phase, where two materials (pad surface and wire) are brought into close connection. When the surfaces and wire are in close connection, interdiffusion or electron sharing happens, generating the wire bond connection.

Thermosonic wire bonding offers electrical interconnection using a combination of pressure, ultrasonic energy, and heat to produce a solid-state weld. Presently, more than 95% of semiconductor chips are ultrasonically welded. Ultrasonic wire bonding is extensively being used for devices requiring high currents and high heat dissipation for heavy wire bonding in the microelectronics industry. The thermosonic method with gold wires is widely adopted, as it provides good bonding strength despite the high cost. The vibrating features of longitudinal-complex transverse vibration systems using multiple resonance frequencies, ranging from 350-980 kHz, are in high demand for ultrasonic wire bonding of ICs, LSI, or electronic devices.

Most of the semiconductor packages, optoelectronic devices, and micro-electro-mechanical systems have been consistently using thermosonic gold wire bonding, as it offers features such as self-cleaning, high-yield rate, flexibility, and reliability. The laser diode packaging industry widely requires wire-bonding to provide electrical connections between laser diode and lead frames of the package. The ultrasonic and thermosonic wire bonding using gold wire of diameter 25µm can be optimized at different temperatures.

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Therefore, an increasing demand for modern methods such, as thermosonic and ultrasonic wire bonding, is anticipated to offer lucrative opportunities for new generation of packaging process, which, in turn, needs new generation of wire bonding packaging processes.

Wire Bonding Market: Prominent Regions

The wire bonding market in Asia Pacific is expected to expand during the forecast period. In terms of region, the global wire bonding market has been segmented into North America, Europe, South America, Asia Pacific, and Middle East & Africa. Asia Pacific accounts for a major share of the global wire bonding market. In the global wire bonding market, Asia Pacific is expected to drive the market during the forecast period due to a rise in the demand from various end-use industries such as aerospace and defense, consumer electronics, automotive, healthcare, energy, telecommunications, transportation, and agriculture. Moreover, various technological advancements and research & development initiatives in IC assembly by key players in the market are supplementing the dominance of these regions.

Asia Pacific marks the presence of robust expanding semiconductor economies including China, Taiwan, South Korea, and Japan. Industrial expansion coupled with the presence of a well-established supply chain network catering to a wide range of industries including automotive, consumer electronics, healthcare, defense, IT & telecommunication, aerospace, transportation, agriculture, energy, and power, is expected to propel the demand for wire bonding ICs and consequently drive the global wire bonding market. Taiwan accounted for a major share in terms of value among all the countries. Moreover, the market in countries, such as China, Taiwan, and South Korea in Asia Pacific is expected to expand considerably, owing to the rising number of IDMs and OSAT in these countries.

For instance, according to SEMI, the semiconductor packaging equipment market in China is fueled by advanced logic memories and new foundry projects. The Government of China took initiative and decided to build their own foundries; SEMI also forecasted that China would remain the second-largest market for equipment, led by Taiwan and South Korea. Moreover, the availability of technologically advanced packaging providing companies catering to the global wire bonding market across the U.S., China, Taiwan, Japan, South Korea, and Germany combined with rising government funding, increasing developments, rising technological research and developments, and availability of wide end-user base are expected to propel the global wire bonding market.

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