Press release
Wire Bonding Market Demand, Research Insights by 2031
According to Transparency Market Research's latest research report on the global wire bonding market for the historical period of 2017-2019 and the forecast period from 2021 to 2031, rising adoption of wire bonding for automotive ICs and increasing demand for MEMS and optoelectronics are expected to boost the global wire bonding market during the forecast periodGet PDF sample for Industrial Insights and business Intelligence @ https://www.transparencymarketresearch.com/sample/sample.php?flag=S&rep_id=83786
MEMS has been known as the revolutionary technology of 21st Century for industrial and consumer products, which deploy silicon-based microelectronics with micromachining technology
MEMS are miniaturized mechanical and electro-mechanical devices that can vary in size from below one micron to several millimeters. They can be magnetometers, microphones, gyrometers, or different types of sensors such as humidity, temperature, and pressure sensors.
Rapid increase in miniaturization trend in electronic systems has led to the popularity of wire bonding of electronic assemblies. For this purpose, fine and ultrafine bonding wires of gold, aluminum, copper, and palladium are extensively required.
Based on chemical composition and wire properties, the bonding wires are adapted to the ceramic/metal MEMS packaging by using automatic bonding machines
Ultrasonic Al wire bonding and thermosonic Au ball bonding are major technologies in optoelectronic manufacturing such as photo patterned thick film package, LTCC packages (low temperature co-fired ceramic), direct bonded copper, and thin film substrate packages
Get a Customized Research Report @ https://www.transparencymarketresearch.com/sample/sample.php?flag=CR&rep_id=83786
This, in turn, is expected to fuel the demand for wire bonding across the globe over the next few years
However, rise in demand for flip chip packaging technology may hamper the market. Flip-chip assembly and wire bonding are the two major processes used for interconnecting ICs. Both the methods have advantages in certain types of applications. Rising consumer demand for high-speed and high-performance package design can be fulfilled by flip chip packaging, which offers various benefits as compared to that offered by traditional wire-bond packaging, such as superior thermal and electrical performance, and smaller device footprint. It also offers processing advantages, such as shorter assembly cycle times, fewer operations, and higher throughput, which can overcome chip shortage.
Rising Adoption of Wire Bonding for Automotive ICs
Increasing usage of wire bonding and rising demand for electrical vehicles in the automotive industry in emerging countries such as China and India are expected to drive the global wire bonding market over the next few years
Automotive ICs should work safely with high reliability for long running of engine; also in harsh working environments such as high temperatures and high humidity. Gold bonding wires can offer higher reliability in such situations to send and receive electrical signals.
Fine gold wires in the range of 15 to 40μm wire diameter are suitable for the electric connection between aluminum electrodes and the internal terminals of automotive ICs
Nexcharge, a joint venture between Exide Industries Ltd. and Leclanche SA, has been using wire bonding technology to connect cells in its Li-ion battery packs. Moreover, all battery packs in Tesla cars utilize the wire bonding technology to manufacture their battery pack.
NSC and its subsidiary, named Nippon Micrometal, has been developing and producing high reliability gold bonding wires that can be used for the improvement of high-temperature reliability of automotive ICs
Advanced Semiconductor Engineering (ASE) and chipmaker Infineon Technologies are also using copper wire bonding in their automotive products
Thus, this factor is projected to have a highly positive impact on the global wire bonding market during the forecast period
View Report @ https://www.transparencymarketresearch.com/wire-bonding-market.html
Wire Bonding Market: Competition Landscape
Detailed profiles of providers of wire bonding have been provided in the report to evaluate their financials, key product offerings, recent developments, and strategies
Key players operating in the global wire bonding market are
Cirexx International Inc.
Powertech Technology Inc.
Alter Technology
Würth Elektronik GmbH & Co. KG
QP Technologies
Tektronix, Inc.
NEOTech Inc.
SMART Microsystems Ltd.
JCET Group Co., Ltd.
Corintech Ltd.
Amkor Technology, Inc.
ASE Technology Holding Co., Ltd.
About Transparency Market Research
Transparency Market Research registered at Wilmington, Delaware, United States, is a global market research firm that offers market analysis reports and business consulting. Our exclusive blend of quantitative forecasting and trends analysis provides forward-looking insights for thousands of decision makers. Our experienced team of Analysts, Researchers, and Consultants use proprietary data sources and various tools & techniques to gather and analyze information.
Our data repository is continuously updated and revised by a team of research experts, so that it always reflects the latest trends and information. With a broad research and analysis capability, Transparency Market Research employs rigorous primary and secondary research techniques in developing distinctive data sets and research material for business reports
For More Research Insights on Leading Industries, Visit our YouTube channel -
https://www.youtube.com/channel/UC8e-z-g23-TdDMuODiL8BKQ
Contact Us:
Rohit Bhisey
Transparency Market Research Inc.
CORPORATE HEADQUARTER DOWNTOWN,
1000 N. West Street,
Suite 1200, Wilmington, Delaware 19801 USA
Tel: +1-518-618-1030
USA - Canada Toll Free: 866-552-3453
Website: https://www.transparencymarketresearch.com
Blog: https://tmrblog.com
Email: sales@transparencymarketresearch.com
Website: http://www.transparencymarketresearch.com
This release was published on openPR.
Permanent link to this press release:
Copy
Please set a link in the press area of your homepage to this press release on openPR. openPR disclaims liability for any content contained in this release.
You can edit or delete your press release Wire Bonding Market Demand, Research Insights by 2031 here
News-ID: 2758078 • Views: …
More Releases from TMR
Emerging Opportunities in Logistics Market with Current Trends Analysis
The global Logistics market is estimated to attain a valuation of US$ 15,273.21 Bn by the end of 2027, states a study by Transparency Market Research (TMR). Besides, the report notes that the market is prognosticated to expand at a CAGR of 4.5% during the forecast period, 2019-2027.
The key objective of the TMR report is to offer a complete assessment of the global market including major leading stakeholders of the…
Energy Measurement IC Market is expected to reach US$ 8.39 Bn by the end of 2031
According to a Transparency Market Research (TMR) research report, the global energy measurement ic market is likely to expand at a CAGR of 7.4% during the forecast period, 2022 to 2031. This suggests that the market is expected to reach US$ 8.39 Bn by the end of 2031.
The study on the energy measurement ic market adopts rigorous and systematic research approaches to understand the growth dynamic of the market. The…
STATCOM UPS Market to Register Double Digit Growth Rate of 16% CAGR by 2024
Over the last decade, rising number of industries and utilities are opting for static synchronous compensator or STATCOM UPS instead of static VAR compensator or SVC UPS. Low harmonic emission coupled with high speed of response is accentuating the expansion of India STATCOM UPS market now and in times to come. Playing a crucial role in voltage control and compensation of reactive power, STATCOM UPS is likely to keep its…
Thin Wafer Processing and Dicing Equipment Market US$692.5 mn by 2024 - TMR
Transparency Market Research (TMR) estimates that the global thin wafer processing and dicing equipment market has a highly consolidative landscape. Disco Corp. accounted for largest share of 56.4% in 2015 and likely to be dominant in the coming years. This is creating monopoly in the thin wafer processing and dicing equipment market in terms of competitive presence. The other key players such as EV Group, Plasma-Therm LLC, Lam Research Corp,…
More Releases for ICs
Europe Energy Measurement ICs Market Size 2025
"Introduction:
The Energy Measurement ICs market is experiencing significant growth, driven by the increasing demand for efficient energy management and the proliferation of smart devices. These integrated circuits play a crucial role in accurately measuring energy consumption in a wide range of applications, from smart meters to electric vehicle (EV) charging stations. Several key drivers are fueling this expansion, including the rising adoption of smart grid technologies, stringent government regulations promoting…
Battery Authentication ICs Market
Battery Authentication ICs Market Analysis:
The global Battery Authentication ICs Market size was estimated at USD 635 million in 2023 and is projected to reach USD 1183.35 million by 2030, exhibiting a CAGR of 9.30% during the forecast period.
North America Battery Authentication ICs market size was USD 165.46 million in 2023, at a CAGR of 7.97% during the forecast period of 2025 through 2030.
To Read Full Market Report -
https://semiconductorinsight.com/report/battery-authentication-ics-market/
Battery Authentication ICs…
Magnetic Position Sensor ICs Market
Magnetic position sensor ICs are tiny integrated circuits that detect the location of a magnet. They use the magnetic field to determine the magnet's position, either linear or rotary, without physically touching it. Magnetic position sensor ICs represent a transformative technology that is revolutionizing position sensing across various industries. As companies embrace automation, electrification, and innovation, magnetic position sensor ICs are poised to play an increasingly pivotal role in…
Phased Array Beamforming ICs Market: Advanced ICs Enabling Precise Beamforming i …
Global Phased Array Beamforming ICs Market Overview:
The Phased Array Beamforming ICs market is a broad category that includes a wide range of products and services related to various industries. This market comprises companies that operate in areas such as consumer goods, technology, healthcare, and finance, among others.
In recent years, the Phased Array Beamforming ICs market has experienced significant growth, driven by factors such as increasing consumer demand, technological advancements, and…
Global Industrial Control Systems (ICS) Security Market
As per latest findings on ICS security components and solutions conducted by Global Market Estimates, the Industrial Control Systems (ICS) Security Market will have a growth rate of 8.2% during the forecast period. Factors responsible for its growth are the increasing number of cybercrimes on the ICS system and initiatives taken by the government to adopt new gird technology across the globe to utilize energy and technology to its fullest…
Global Ethernet ICs Market Demand 2020-2025
This report also researches and evaluates the impact of Covid-19 outbreak on the Ethernet ICs industry, involving potential opportunity and challenges, drivers and risks. We present the impact assessment of Covid-19 effects on Ethernet ICs and market growth forecast based on different scenario (optimistic, pessimistic, very optimistic, most likely etc.).
Scope of the Report:
The report presents the market outlook for the Indian Phospho Gypsum product from the year 2019 to the year 2025.…
