Press release
AiP (Antenna in Package) Module Market Future Outlook 2023-2029, Industry Demand, Trends, Size, New Opportunity, Scope, by Types - LTCC, HDI, FOWLP
The AiP (Antenna in Package) Module Market report detailed company profiles, revenue shares, portfolio innovations, regional product footprint, developmental strategies, pricing structure, target markets, and near-term plans of market leaders. This report evaluates historical data on the AiP (Antenna in Package) Module Market growth and compares it with current market situations. This report provides data to the customers that are of historical & statistical significance informative.Download FREE Sample Report @ https://www.reportsnreports.com/contacts/requestsample.aspx?name=7211361
AiP is a technology that integrates an antenna and a chip into a package to achieve system-level wireless functions. The dielectric materials of the package antenna are mainly ceramic, organic, and molding compounds, and the conductor materials are gold, silver, and copper. It implements one or more antennas in the IC package and can carry bare radio frequency chips (transceivers).
By Company
- Qualcomm
- Intel
- Murata
- Skyworks
- Qorvo
- Samsung
- Broadcom
- Huizhou Speed Wireless Technology
Segment by Type
- LTCC
- HDI
- FOWLP
Segment by Application
- Consumer Electronics
- Vehicle Electronics
- Industrial Internet of Things
- Communication Base Station
- Others
Production by Region
- North America
- Europe
- China
- Japan
- South Korea
Direct Purchase of the Global AiP (Antenna in Package) Module Market Research Report (Use Available 25% Discount Coupon Code: DIS25) https://www.reportsnreports.com/purchase.aspx?name=7211361
Table of Contents
1 Study Coverage
1.1 AiP (Antenna in Package) Module Product Introduction
1.2 Market by Type
1.2.1 Global AiP (Antenna in Package) Module Market Size by Type, 2018 VS 2022 VS 2029
1.2.2 LTCC
1.2.3 HDI
1.2.4 FOWLP
1.3 Market by Application
1.3.1 Global AiP (Antenna in Package) Module Market Size by Application, 2018 VS 2022 VS 2029
1.3.2 Consumer Electronics
1.3.3 Vehicle Electronics
1.3.4 Industrial Internet of Things
1.3.5 Communication Base Station
1.3.6 Others
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global AiP (Antenna in Package) Module Production
2.1 Global AiP (Antenna in Package) Module Production Capacity (2018-2029)
2.2 Global AiP (Antenna in Package) Module Production by Region: 2018 VS 2022 VS 2029
2.3 Global AiP (Antenna in Package) Module Production by Region
2.3.1 Global AiP (Antenna in Package) Module Historic Production by Region (2018-2023)
2.3.2 Global AiP (Antenna in Package) Module Forecasted Production by Region (2024-2029)
2.3.3 Global AiP (Antenna in Package) Module Production Market Share by Region (2018-2029)
2.4 North America
2.5 Europe
2.6 China
2.7 Japan
2.8 South Korea
3 Executive Summary
3.1 Global AiP (Antenna in Package) Module Revenue Estimates and Forecasts 2018-2029
3.2 Global AiP (Antenna in Package) Module Revenue by Region
3.2.1 Global AiP (Antenna in Package) Module Revenue by Region: 2018 VS 2022 VS 2029
3.2.2 Global AiP (Antenna in Package) Module Revenue by Region (2018-2023)
3.2.3 Global AiP (Antenna in Package) Module Revenue by Region (2024-2029)
3.2.4 Global AiP (Antenna in Package) Module Revenue Market Share by Region (2018-2029)
3.3 Global AiP (Antenna in Package) Module Sales Estimates and Forecasts 2018-2029
3.4 Global AiP (Antenna in Package) Module Sales by Region
3.4.1 Global AiP (Antenna in Package) Module Sales by Region: 2018 VS 2022 VS 2029
and More…
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