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Semiconductor Test and Burn-In Sockets Market:Size, Share, Growth, Analysis, Key Players, Revenue, Growth | Valuates Reports
Global Semiconductor Test and Burn-In Sockets MarketA test socket is a custom-designed electro-mechanical interface that delivers extremely clean electrical signal paths to connect the chip to the ATE. A typical test socket consists of three components: The socket body or cartridge is a customized piece of metal and plastic with precision cut cavities.
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The global Semiconductor Test and Burn-In Sockets market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for Semiconductor Test and Burn-In Sockets is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Semiconductor Test and Burn-In Sockets is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Semiconductor Test and Burn-In Sockets include Yamaichi Electronics, LEENO, Cohu, ISC, Smiths Interconnect, Enplas, Sensata Technologies, Johnstech and Yokowo, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Semiconductor Test and Burn-In Sockets, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Test and Burn-In Sockets.
The Semiconductor Test and Burn-In Sockets market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Semiconductor Test and Burn-In Sockets market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Test and Burn-In Sockets manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
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Key Segmentations
By Company
• Yamaichi Electronics
• LEENO
• Cohu
• ISC
• Smiths Interconnect
• Enplas
• Sensata Technologies
• Johnstech
• Yokowo
• WinWay Technology
• Loranger
• Plastronics
• OKins Electronics
• Qualmax
• Ironwood Electronics
• 3M
• M Specialties
• Aries Electronics
• Emulation Technology
• Seiken Co., Ltd.
• TESPRO
• MJC
• Essai (Advantest)
• Rika Denshi
• Robson Technologies
• Test Tooling
• Exatron
• JF Technology
• Gold Technologies
• Ardent Concepts
Segment by Type
• BGA
• QFN
• WLCSP
• Others
Segment by Application
• Memory
• CMOS Image Sensor
• High Voltage
• RF
• SOC, CPU, GPU, etc.
• Others
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