Semiconductor Plastic Encapsulation Press Market Insights, Forecast to 2030 | Valuates Reports

Semiconductor Plastic Encapsulation Press Market

Semiconductor plastic packaging press is a kind of equipment used in the packaging process of semiconductor chips. During semiconductor packaging, chips are usually encapsulated in plastic encapsulation materials to provide protection and connect circuits. The plastic packaging press is used to press the chip and packaging material to ensure that the packaging material is firmly fixed on the chip and to ensure the reliability of the circuit connection. These presses typically include heating and cooling functions to control the temperature of the potting material, as well as a pressure control system to ensure proper press force. Semiconductor plastic packaging presses play a key role in the semiconductor industry and are used to produce various types of packaged chips, such as QFP (Quad Flat Package), BGA (Ball Grid Array), etc.
The global Semiconductor Plastic Encapsulation Press market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.

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Report Scope
The Semiconductor Plastic Encapsulation Press market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Plastic Encapsulation Press market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Plastic Encapsulation Press manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

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Segment by Type
• Compression Molding Plastic Sealing Press
• Injection Molding Plastic Sealing Press

Segment by Application
• Semiconductor Industry
• Electronic Industry
• New Energy Industry
• Others

By Companies
TOWA Corporation, ASM Pacific Technology Ltd., Shinkawa Ltd., Kulicke & Soffa Industries, Inc., Besi N.V., Hesse Mechatronics, Inc., Palomar Technologies, Inc., Fico Molding Solutions B.V., West Bond, Inc., Hybond, Inc., GPD Global, Inc., ESEC SA, Unitemp GmbH, Mech-El Industries, Inc., Orthodyne Electronics Corporation

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This release was published on openPR.