Wafer Level Packaging Market, Trends, Size, Development, Growth and Forecast to 2020

The global wafer level packaging market is growing with a significant rate, due to changes in electronics industry infrastructure and increasing demand for portable consumer devices. However, the solder joint thermal cycling reliability of standard wafer level packaging is restraining the growth of the global wafer level packaging market. The Asia-Pacific wafer level packaging market is growing with a significant rate, due to the increasing demand for tablets and smartphones in the region.

Explore more or request TOC on “Wafer Level Packaging Market” at: www.psmarketresearch.com/market-analysis/wafer-level-packaging-market

In the semiconductor packaging industry, the wafer level packaging market is growing with the fastest rate, due to the increasing demand for smaller, lighter, faster, and less expensive electronic products, with low cost packaging and high performance. The rapid advancements in integrated circuit fabrication are also supporting the growth of the wafer level packaging technology in the semiconductor packaging industry. As the wafer level packaging is intrinsically chip size package, its form factor is very small. In comparison to die level packaging such as wird-bond type packaging, the wafer level packaging has low packaging cost. With the increased in wafer size, or decreased die size in die level packaging, the packaging cost becomes higher than manufacturing cost of IC. Whereas, in wafer level packaging, its packaging cost per wafer is comparable to the total IC cost. This means that wafer level packaging is more cost-effective with increased wafer size or decreased die size. Due to such advantages, most of the integrated circuit manufacturers are incorporating wafer level packaging in their designs.

As wafer level packaging is intrinsically a chip sized pack, which has highest potential for future single chip packages. Wafer level testing and wafer fabrication replaces all the testing and packaging operations of the dice. Hence, wafer level packaging becomes more cost effective, due to the increasing wafer size or decreasing die size. However, solder ball consistency subjected to temperature cycling, becomes the weakest point of the wafer level packaging, due to intrinsic mismatch of the coefficient of thermal expansion between plastic PCB material and silicon chip.

Browse related market research at: www.psmarketresearch.com/industry-report/consumer-products

Some of the competitors in the global wafer level packaging market are ChipMOS TECHNOLOGIES INC., IQE PLC, Amkor Technology Inc., Siliconware Precision Industries Co. Ltd., TriQuint Semiconductor Inc., China Wafer Level CSP Co. Ltd., Jiangsu Changjiang Electronics Technology Co. Ltd., Powertech Technology Inc., Fujitsu Limited, Chipbond Technology Corporation, Nemotek Technologie S.A., and STATS ChipPAC Ltd.

About P&S Market Research

P&S Market Research is a market research company, which offers market research and consulting services for various geographies around the globe. We provide market research reports, industry forecasting reports, business intelligence, and research based consulting services across different industry/business verticals.

As one of the top growing market research agency, we’re keen upon providing market landscape and accurate forecasting. Our analysts and consultants are proficient with business intelligence and market analysis, through their interaction with leading companies of the concerned domain. We help our clients with B2B market research and assist them in identifying various windows of opportunity, and framing informed and customized business expansion strategies in different regions.

Contact:
Abhishek
Executive – Client Partner
347, 5th Ave. #1402
New York City, NY - 10016
Toll-free: +1-888-778-7886 (USA/Canada)
Email: enquiry@psmarketresearch.com
Web: https://www.psmarketresearch.com

347, 5th Ave. #1402
New York City, NY - 10016
Toll-free: +1-888-778-7886 (USA/Canada)

This release was published on openPR.