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Through Glass Via (TGV) Substrate Market Revenue, Insights, Overview, Outlook, Analysis | Valuates Reports

08-13-2025 10:22 AM CET | Advertising, Media Consulting, Marketing Research

Press release from: Valuates Reports

Through Glass Via (TGV) Substrate Market Size

The global Through Glass Via (TGV) Substrate market was valued at US$ 129 million in 2024 and is projected to reach US$ 508 million by 2031, registering a CAGR of 22.0% during the forecast period. This rapid growth is driven by rising adoption in consumer electronics, advancements in semiconductor packaging, and the increasing demand for miniaturized high-performance devices.

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Market Share Analysis
Global key players dominating the TGV Substrate market include Corning, LPKF, KISO WAVE Co., Ltd., Samtec, and Xiamen Sky Semiconductor, with the top five accounting for 73% of the market share. Japan leads the market with a 26% share, followed by North America (24%) and Europe (22%).

By product type, the 300 mm Wafer segment holds a commanding 65% share, while consumer electronics remains the leading application area with 62% market share, followed by the automobile industry.

by type
• 300 mm Wafer
• 200 mm Wafer
• ≤ 150 mm Wafer

by application
• Consumer Electronics
• Automobile Industry

key companies
Corning, LPKF, Samtec, KISO WAVE Co., Ltd., Xiamen Sky Semiconductor, Tecnisco, Microplex, Plan Optik, NSG Group, Allvia

Frequently Asked Questions (FAQs)

Q1: What is driving the rapid growth of the Through Glass Via (TGV) Substrate market?
A1: The growth is primarily driven by rising demand for miniaturized, high-performance devices in consumer electronics, advancements in semiconductor interconnect technology, and expanding applications in automotive electronics.

Q2: Which region leads the global TGV Substrate market?
A2: Japan currently holds the largest market share at 26%, followed by North America and Europe, driven by strong semiconductor manufacturing ecosystems.

Q3: Who are the top players in the TGV Substrate market?
A3: Leading companies include Corning, LPKF, Samtec, KISO WAVE Co., Ltd., and Xiamen Sky Semiconductor, collectively accounting for over 70% of the global market.

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