Single Phase Direct To Chip Cooling Market to Reach CAGR 18% by 2031 Top 10 Company Globally

Single-phase direct-to-chip cooling removes heat from CPUs, GPUs and accelerators through liquid cold plates mounted directly on the package, distributing coolant via manifolds to a coolant distribution unit (CDU) at the rack or row. Against the backdrop of AI and HPC-driven rack densities, DTC has moved from niche pilots to a mainstream design option in new builds and high-density retrofits, often in hybrid deployments alongside rear-door heat exchangers. Analysts and vendors consistently note that DTC provides materially better thermal performance and energy efficiency than air, enabling higher TDP chips and greater compute per rack while lowering total energy use and, in closed-loop designs, dramatically cutting water consumption.

The global Single-phase direct-to-chip cooling market is estimate at $1,300 million for 2024 and the prevailing growth corridor of roughly 18% compound annual growth rate to 2031, implying a market of about $4,138 million by 2031. The average global 2024 selling prices at roughly $900 per units. Worldwide unit volumes in 2024 equate to approximately 1,44 million units.
Latest Trends and Technological Developments
In March 2025, CoolIT announced a single-phase DTC cold plate rated for 4,000 W per device, more than doubling prior single-phase expectations and directly targeting next-gen AI accelerators. In late 2024 and into 2025, vendors also launched 1 MW-class CDUs to support Blackwell-era and similar rack densities, signaling steady maturation of rack/row-scale liquid logistics. Separately, Microsoft began deploying closed-loop, chip-level liquid systems in August 2024 to eliminate evaporative water use at scale, underlining sustainabilitys role in design choices. Commercial outlooks for 2025 emphasize that liquid installations in new builds are rapidly becoming default in high-density halls, with DTC one of the two most common implementations alongside RDHx.
Across Asia, hyperscalers and colocation providers are designing for liquid-first or liquid-ready capacity as AI clusters scale. Independent outlooks for the regions liquid-cooling market show strong double-digit growth through the early 2030s, with Japan, South Korea and Australia as early anchors and China/Taiwan vital in the component supply chain for cold plates, quick disconnects and manifolds. JLLs 2025 global data center outlook notes that within new construction, liquid infrastructure is increasingly a default assumption in high-density blocks, with DTC and RDHx the most common paths. Specific deployments and tenders in Asia regularly call out liquid cooling-ready specifications for future AI loads, while component vendors in the region expand manufacturing to de-risk supply chains.

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Single Phase Direct To Chip Cooling by Type:
Cold Plate Cooling

Mircro Channel

Single Phase Direct To Chip Cooling by Application:
CPU

GPU

FPGA

Others

Global Top 10 Key Companies in the Single Phase Direct To Chip Cooling Market
Equinix

CoolIT Systems

Motivair

Boyd

JetCool

ZutaCore

Accelsius

Asetek

Veriv

Alfa Laval

Regional Insights
Southeast Asia is moving from power-and-land arbitrage to high-density, AI-ready designs. Indonesia has commissioned AI-ready, liquid-equipped capacity, exemplified by DCIs 36 MW JK6 facility near Jakarta, launched in mid-2025 with liquid cooling for high-density workloads. Malaysia is awarding new liquid cooling-ready campuses in Cyberjaya and Johor, and operators across the sub-region are shifting toward liquid to manage heat flux and water constraints in hot, humid climates. Region-wide market reports through 2030 call out an accelerating adoption curve for DTC and immersion as sustainability and grid constraints intensify.
Single Phase Direct To Chip Cooling by Region:
North America
Europe
China
Japan
India
South East Asia

Despite strong momentum, three bottlenecks are prominent. First, capital intensity and integration complexity remain higher than for air, with credible analyses documenting 2030% server-level premiums and significant project-level adders for CDUs and facility interfaces. Second, supply chain frictions in universal quick-disconnects, manifolds and other liquid-specific components have periodically slowed hyperscale ramps, as highlighted in reporting around Blackwell-class systems. Third, measurement frameworks like PUE are less informative once liquid affects both IT and facility power, and operators are shifting to more holistic metrics such as TUE. These factors, along with skills/training needs and risk management for leaks, shape deployment timelines and vendor selection.
For operators planning AI/HPC blocks, the near-term optimum is a hybrid topology: single-phase DTC at the chip plus RDHx at the rack, backed by liquid-to-liquid CDUs sized for future 4000 W-class devices. Designing manifolds, redundancy, and CDU capacity for step-function density increases avoids stranded retrofits when new accelerators arrive. Closed-loop liquid programs that minimize or eliminate evaporative water use are becoming a board-level sustainability lever, materially improving water balance without sacrificing performance. Given the maturing supply base in Asia and the manufacturing moves in North America and Taiwan, multisource component strategies reduce lead-time risk.

Product Models
Single-phase direct-to-chip cooling refers to liquid-based thermal management techniques that bring coolant directly to the surface of high-heat semiconductor devices without undergoing a phase change.
Cold plate cooling where fluid passages are machined or brazed into a plate that interfaces with the chip. Notable products include:
JetCool SmartPlate Cold Plate: High-performance liquid cold plate using microconvective (jet-based) cooling for over 3,000 W TDP chips
Lori Vacuum-Brazed Copper Cold Plate: Custom microchannel-capable plates for CPUs, GPUs, AI hardware built via brazing/CNC methods
ATS (Advanced Thermal Solutions) Cold Plates: Tubed designs in copper/stainless/aluminum, customizable, for high-power electronics
Boyd Liquid Cold Plates (Machined Stamped, Tubed): Options including stamped, round/flat tube, meso-channel designs customized for various thermal needs
Mikros Technologies Microchannel Cold Plates: Although microchannel emphasis, they also offer traditional cold plate forms with high heat transfer and low thermal resistance.
Microchannel cooling which uses extremely fine, high-density channels to maximize heat transfer surface area. Examples include:
Mikros Technologies Microchannel Cold Plate: High-efficiency microchannel cold plates tailored for data centers, delivering low thermal resistance.
JetCool SmartPlate (via microconvective microchannel arrays): Uses jet impingement, essentially a microchannel/jet hybrid, providing 3× lower thermal resistance vs. standard microchannels
Aquasar Micro-channel Coolers (On-chip): Microchannel coolers integrated directly on-chip for supercomputer processing units, enabling efficient water-based cooling
LHCb VELO Upgrade Microchannel Coolers: Silicon microchannel cooling deployed at scale for LHCb tracking modules; radiation-hard and high-performance
JetCool SmartLid (Liquid-to-Chip Module): Embedded microconvective solution eliminating TIM entirely with microchannel-like jets delivering 10× heat transfer improvement
Single-phase direct-to-chip cooling has crossed the commercialization chasm. The 2024 market at roughly $1,300 million is set to more than triple by 2031 on the back of AI-driven TDPs and denser racks, with Asia and particularly Southeast Asia designing liquid-ready campuses to compete for hyperscale investment. Technology announcements through 20242025 confirm a clear roadmap to 34 kW per device and megawatt-class CDUs, while sustainability priorities accelerate adoption of closed-loop liquid. Execution risks remain, but operators that standardize on DTC-ready designs and de-risk supply chains will capture density, energy and water advantages ahead of peers.

Investor Analysis
For investors in equipment suppliers, integrators and liquid-ready data center platforms, three signals stand out. First, revenue visibility is improving as liquid infrastructure becomes a default line item in high-density builds, expanding the total addressable market from pilots to programmatic rollouts. Second, technology risk is receding: single-phase plates and CDUs have demonstrably scaled to Blackwell-class thermals, and major operators are now prioritizing closed-loop systems for water savings, aligning with ESG screens and policy incentives. Third, Southeast Asias surge in liquid-ready capacity creates a multi-year capex cycle in Indonesia and Malaysia, with faster time-to-market than land-constrained hubs and policy tailwinds for green infrastructure. This combination of secular AI demand, validated technology, and regional growth vectors supports premium multiples for proven DTC suppliers and favors platform investments in liquid-first campuses that can pre-lease AI halls at superior yields.
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5 Reasons to Buy This Report
It reconciles 2024 DTC market size using multiple independent sources and provides a transparent, conservative CAGR model to 2031.
It quantifies 2024 pricing and unit volumes with defendable ranges tied to vendor disclosures and integrator practices.
It captures the very latest technology milestones and sustainability pivots including 4,000 W single-phase plates, 1 MW-class CDUs and closed-loop waterless deployments.
It offers granular Asia and Southeast Asia insights with real project examples and policy-driven context for investors and operators.
It distills strategic design guidance and risk factors that directly influence returns, from supply-chain de-risking to metric selection beyond PUE.
5 Key Questions Answered
What was the global single-phase DTC market size in 2024, and what is a credible CAGR to 2031 based on independent trackers?
What are realistic 2024 price bands for server-level DTC kits and CDUs, and what do those imply for global unit shipments?
Which technology milestones in 20242031 materially change TCO and density planning for AI clusters?
How are Asia and Southeast Asia operators incorporating DTC into new builds, and where are the earliest large AI-ready deployments?
Who are the leading vendors in single-phase DTC and how is the competitive landscape evolving as integrators and component suppliers scale?
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: key insights, key emerging trends, etc.
Chapter 3: Manufacturers competitive analysis, detailed analysis of the product manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 5 & 6: Sales, revenue of the product in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 7: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 8: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 9: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 10: The main points and conclusions of the report.

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