openPR Logo
Press release

System-in-Package Technology Market Size, Revenue Share, Insights & Future Outlook

10-14-2025 02:51 PM CET | Advertising, Media Consulting, Marketing Research

Press release from: Valuates Reports

System-in-Package Technology Market Size

The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period.

The global market for System-in-Package Technology was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.

Download Free Sample: https://reports.valuates.com/request/sample/QYRE-Auto-10W7899/Global_System_in_Package_Technology_Market_Insights_and_Forecast_to_2028?utm_source=Openpr&utm_medium=Referral

Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.

By Type
• 2-D IC Packaging
• 2.5-D IC Packaging
• 3-D IC Packaging
• Multifunctional Substrate Integrated Component Package

By Application
• Consumer Electronics
• Automobile
• Telecommunications
• Wireless Communication

Key Companies
NXP, Amkor Technology, ASE, Jiangsu Changjiang Electronics Technology (JCET), Siliconware Precision Industries (SPIL), United Test and Assembly Center (UTAC), Hana Micron, Hella, IMEC, Inari Berhad, Infineon, ams, Apple, ARM, Fitbit, Fujitsu, GaN Systems, Huawei, Qualcomm, SONY, Texas Instruments, Access, Analog Devices

View Full Report: https://reports.valuates.com/market-reports/QYRE-Auto-10W7899/global-system-in-package-technology?utm_source=Openpr&utm_medium=Referral

Please reach us at sales@valuates.com

Address:
Valuates,
4th Floor,
Balaraj's Arcade,
Whitefield Main road,
Bangalore 560066

Valuates offers an extensive collection of market research reports that helps companies to take intelligent strategical decisions based on current and forecasted Market trends.

This release was published on openPR.

Permanent link to this press release:

Copy
Please set a link in the press area of your homepage to this press release on openPR. openPR disclaims liability for any content contained in this release.

You can edit or delete your press release System-in-Package Technology Market Size, Revenue Share, Insights & Future Outlook here

News-ID: 4223592 • Views:

More Releases from Valuates Reports

Embedded Substrate (ETS) Market Size, Revenue Share, Insights & Future Outlook
Embedded Substrate (ETS) Market Size The global market for Embedded Substrate (ETS) was valued at US$ 1242 million in the year 2024 and is projected to reach a revised size of US$ 2182 million by 2031, growing at a CAGR of 8.5% during the forecast period. According to our Semiconductor Research Center, in 2022, the global semiconductor materials was valued at US$ 70.3 billion. The semiconductors materials are mainly dominated by companies
Semiconductor Die Attach Materials Market: Size, Revenue Share, Insights & Futur …
Semiconductor Die Attach Materials - Market Size The global market for Semiconductor Die Attach Materials was estimated to be worth US$ 496.9 million in 2023 and is forecast to a readjusted size of US$ 681.5 million by 2030 with a CAGR of 5.0% during the forecast period 2024-2030 Download Free Sample: https://reports.valuates.com/request/sample/QYRE-Auto-2N10351/Global_Semiconductor_Die_Attach_Materials_Market_Insights_Forecast_to_2028?utm_source=Openpr&utm_medium=Referral Typical die-attach materials are PbSn, PbSnAg or PbInAg alloys. These alloys wet conventional substrates and die metallizations due to the formation
Through Silicon Via (TSV) Equipment Market Size, Revenue Share, Insights & Futur …
Through Silicon Via (TSV) Equipment Market Through silicon via (TSV) is a vertical interconnection technology that penetrates silicon wafers or chips. It achieves fully perforated vertical electrical connections between chips, between chips and wafers, and between wafers by drilling tiny holes (via) on silicon wafers and filling them with conductive materials (such as copper, polysilicon, tungsten, etc.). The basic structure of TSV includes two metal shells (i.e., upper metal and lower
Fan-Out Wafer Level Packaging Market Size, Revenue Share, Insights & Future Outl …
Fan-Out Wafer Level Packaging Market Size In 2024, the global market size of Fan-Out Wafer Level Packaging was estimated to be worth US$ 1970 million and is forecast to reach approximately US$ 6983 million by 2031 with a CAGR of 20.1% during the forecast period 2025-2031. Download Free Sample: https://reports.valuates.com/request/sample/QYRE-Auto-1I9329/Global_Fan_Out_Wafer_Level_Packaging_Market_Size_Status_and_Forecast_2022?utm_source=Openpr&utm_medium=Referral&utm_campaign=QYRE-Auto-1I9329 The Fan-Out WLP technique involves cutting and separating the chip and then embedding the chip inside the panel. The procedure is to attach

All 5 Releases


More Releases for Technology

Insurance Technology Market Outlook 2021 | TIA Technology, Patriot Technology So …
Insurance Technology Market has recently added by Qurate Research to its vast repository. This intelligence report includes investigations based on Current scenarios, Historical records, and future predictions. Report includes overview, which interprets value chain structure, industrial environment, regional analysis, applications, market size, and forecast. The report is integrated with imperative insights on the market, which will support the clients to make precise business decisions. The report incorporates data regarding the
Global Insurance Technology Market 2019 – Top Companies Xchanging, Insurance T …
"Insurance Technology or Insurtech refers to the use of technology innovations designed to squeeze out savings and efficiency from the current insurance industry model. Insurtech is a portmanteau of “insurance” and “technology” that was inspired by the term fintech.” Global Insurance Technology Market Research Report is a valuable source of insightful data for business strategists. Provides industry Overviews, including Growth Analysis, Past & Future Costs, Revenue, Demand and Supply Data (where
Insurance Technology Market Analysis By Major Players | Xchanging, Insurance Tec …
The global Insurance Technology market size was million US$ and it is expected to reach million US$ by the end of 2025, with a CAGR of between 2018 and 2025. This report studies the Insurance Technology market size by players, regions, product types and end industries, history data 2013-2017 and forecast data 2018-2025; This report also studies the global market competition landscape, market drivers and trends, opportunities and challenges, risks and
Insurance Technology Market – Major Technology Giants in Buzz Again | TIA Tech …
Global Insurance Technology Market Size, Status and Forecast 2025 is latest research study released by HTF MI evaluating the market, highlighting opportunities, risk side analysis, and leveraged with strategic and tactical decision-making support. The study provides information on market trends and development, drivers, capacities, technologies, and on the changing capital structure of the Global Insurance Technology Market. Some of the key players profiled in the study are Xchanging, Insurance Technology
Global Insurance Technology Market 2018-2025 Health and Life Insurance By Xchang …
In 2017, the global Insurance Technology market size was million US$ and it is expected to reach million US$ by the end of 2025, with a CAGR of between 2018 and 2025. This report studies the Insurance Technology market size by players, regions, product types and end industries, history data 2013-2017 and forecast data 2018-2025; This report also studies the global market competition landscape, market drivers and trends, opportunities and challenges,
Ultrasonic Technologies Market by Technology (Motor/actuator technology, medical …
The global ultrasonic technologies market provides alteration of processes with the use of oscillating sound of very high frequency. It is expected that the market would grow at a respectable rate as the technology is being widely adopted. Various verticals such as industrial units and healthcare are using ultrasound as it is considered a highly efficient technology. In the healthcare sector, it is used for diagnosis and treatment by minimal