Wafer Edge Grinding Machine Market Driven by Rising Semiconductor Manufacturing Expansion | Valuates Reports

Wafer Edge Grinding Machine Market
The global market for Wafer Edge Grinding Machine was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.

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The Wafer Edge Grinding Machine Market is witnessing strong growth, supported by the global semiconductor industry's continuous scaling and demand for ultra-flat, defect-free wafers used in integrated circuits, memory chips, and power electronics. As wafer diameters increase and process tolerances tighten, manufacturers are increasingly investing in precision wafer edge grinding machines to enhance yield, prevent chipping, and ensure uniformity for advanced semiconductor fabrication.

By Type
The 8-12 inch segment dominates the market, as most semiconductor fabs worldwide operate within this wafer size range. However, the above 12-inch segment is projected to record the highest growth rate, driven by investments in next-generation 300 mm and upcoming 450 mm wafer production lines by major foundries and IDMs (Integrated Device Manufacturers). The below 8-inch segment continues to serve research and small-volume specialty production in MEMS, LED, and sensor manufacturing.

By Application
The semiconductor manufacturing plants segment accounts for the largest market share, as leading wafer fabrication facilities demand edge grinding systems that ensure dimensional accuracy and reduce edge-related defects during subsequent polishing and etching processes. The research institutes segment is showing steady growth due to rising R&D activities focused on wafer surface preparation, compound semiconductors, and next-generation materials like SiC and GaN.

By Company
According to verified industry data, ACCRETECH (Tokyo Seimitsu) holds the largest market share globally, driven by its advanced wafer edge grinder portfolio and established partnerships with top semiconductor manufacturers in Japan, South Korea, and Taiwan. SpeedFam and Revasum are among the key competitors with significant growth rates, thanks to their expertise in precision surface processing and continuous innovation in grinding and polishing solutions for 200 mm and 300 mm wafers. Peter Wolters and AxusTech maintain strong positions in Europe and North America, respectively, focusing on high-end precision grinding systems for R&D and production fabs. Emerging Asian companies such as Daitron, MAT Inc, and Dikema Precision Machinery are rapidly gaining traction due to cost-effective, localized solutions catering to China's fast-growing semiconductor equipment market.

Regional Insights
Asia-Pacific remains the leading production and consumption region, driven by massive semiconductor investments in China, Japan, South Korea, and Taiwan. The region is expected to maintain its dominance due to ongoing wafer fab expansions and local manufacturing incentives. North America and Europe also contribute significantly, with demand supported by advanced chip production and research initiatives in the U.S., Germany, and France. Meanwhile, India and Brazil are emerging as potential markets as they expand semiconductor research and wafer processing capabilities.

The Wafer Edge Grinding Machine Market is expected to continue its upward trajectory, supported by increasing wafer sizes, tighter process requirements, and the push for localized semiconductor manufacturing. The combination of automation, AI-enabled metrology, and next-gen grinding technologies will play a pivotal role in shaping the market's future growth path.

by Type

• Below 8 Inches
• 8-12 Inches
• Above 12 Inches

by Application

• Semiconductor Manufacturing Plants
• Research Institutes

By Company

ACCRETECH, SpeedFam, Revasum, AxusTech, Peter Wolters, Daitron, MAT Inc, Dikema Presicion Machinery, Dynavest

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