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Silicon Carbide Wafer Slicing Machine Market Size, Trends & Forecasts | Valuates Reports
Silicon Carbide Wafer Slicing Machine Market SizeThe global market for Silicon Carbide Wafer Slicing Machine was valued at US$ 164 million in the year 2024 and is projected to reach a revised size of US$ 436 million by 2031, growing at a CAGR of 15.2% during the forecast period.
This report aims to provide a comprehensive presentation of the global market for Silicon Carbide Wafer Slicing Machine, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Silicon Carbide Wafer Slicing Machine.
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The Silicon Carbide Wafer Slicing Machine market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Silicon Carbide Wafer Slicing Machine market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
By Type
• Diamond Slicing
• Laser Slicing
By Application
• Foundry
• IDM
Key Companies
DISCO Corporation, Suzhou Delphi Laser Co, Han's Laser Technology, 3D-Micromac, Synova S.A., HGTECH, ASMPT, GHN.GIE, Wuhan DR Laser Technology, Shangji Automation
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