Press release
System in Package (SiP) Technology Market Size Of Around $30 billion by 2022
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Increase in demand for high performance compact size electronic devices and need for low power consumption devices is expected to drive the market. Moreover, it supports high input impedance and improved parallel current sharing, which fuels the market growth. However, performance issues such as current leakage and breakdown hamper the growth of the market. Irrespective of these challenges, rapid adoption of smartphone & tablets in the emerging countries are expected to provide huge opportunities for growth in the future.
The SiP market is segmented based on packaging technology, packaging type, interconnection technology, application, and geography. The packaging technology segment is divided into 2-D IC packaging, 2.5-D IC packaging, and 3-D IC packaging. The packaging type segment is classified into flat packages, pin grid arrays, surface mount, small outline packages, and others. The interconnection technology is bifurcated into wire bond and flip chip. Based on application, the market is classified into consumer electronics, automotive, telecommunications, industrial system, military, defense & aerospace, and others. Geographically, it is analyzed across North America (U.S., Mexico, and Canada), Europe (UK, Germany, France, and rest of Europe), Asia-Pacific (China, India, Japan, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).
Major companies profiled in the report include Amkor Technology Inc., Fujitsu Ltd., Toshiba Corporation, Qualcomm Incorporated, Renesas Electronics Corporation, Samsung Electronics Co Ltd, Jiangsu Changjiang Electronics Technology Co., Ltd., ChipMOS Technologies Inc., Powertech Technologies Inc., and ASE Group.
SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET KEY BENEFITS:
Comprehensive analysis of the current trends and future estimations of the global SiP technology market is provided in the report.
The report provides a competitive scenario of the market along with growth trends, structure, driving factors, scope, opportunities, and challenges.
The report includes a detailed analysis of the key segments to provide insights on the market dynamics.
Porter’s Five Forces analysis highlights the potential of buyers and suppliers as well as provides insights on the competitive structure of the market to devise effective growth strategies and facilitate better decision-making.
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SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET SEGMENTATION:
The global SiP technology market is segmented based on packaging technology, packaging type, interconnection technology, application, and geography.
BY PACKAGING TECHNOLOGY
• 2-D IC Packaging
• 2.5-D IC Packaging
• 3-D IC Packaging
BY PACKAGING TYPE
• Flat Packages
• Pin Grid Arrays
• Surface Mount
• Small Outline Packages
• Others (Through-Hole Packages, Chip Carrier)
BY INTERCONNECTION TECHNOLOGY
• Wire Bond
• Flip Chip
BY APPLICATION
• Consumer Electronics
• Automotive
• Telecommunications
• Industrial System
• Military, Defense & Aerospace
• Others (Traction & Medical)
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BY GEOGRAPHY
• North America
• U.S.
• Mexico
• Canada
• Europe
• UK
• Germany
• France
• Rest of Europe
• Asia-Pacific
• India
• China
• Japan
• South Korea
• Rest of Asia-Pacific
• LAMEA
• Latin America
• Middle East
• Africa
KEY PLAYERS
• Amkor Technology Inc.
• Fujitsu Ltd.
• Toshiba Corporation
• Qualcomm Incorporated
• Renesas Electronics Corporation
• Samsung Electronics Co Ltd
• Jiangsu Changjiang Electronics Technology Co., Ltd.
• ChipMOS Technologies Inc.
• Powertech Technologies Inc.
• ASE Group
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Other players in the value chain include (profiles not included in the report):
• GS Nanotech
• Siliconware Precision Industries Co., Ltd.
• Chipbond Technology Corporation
• Octavo Systems LLC
Table Of Contents
• Chapter: 1 INTRODUCTION
• Chapter: 2 EXECUTIVE SUMMARY
• Chapter: 3 MARKET OVERVIEW
• Chapter: 4 GLOBAL SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET, BY PACKAGING TECHNOLOGY
• Chapter: 5 GLOBAL SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET, BY PACKAGING TYPE
• Chapter: 6 GLOBAL SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET, BY INTERCONNECTION TECHNOLOGY
• Chapter: 7 SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET, BY APPLICATION
• Chapter: 8 SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET, BY GEOGRAPHY
• Chapter: 9 RELATED INDUSTRY INSIGHTS
• Chapter: 10 COMPANY PROFILES
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