Press release
Global Semiconductor Advanced Packaging Market to grow at a CAGR of 8.45% during the period 2017-2021.
Semiconductor packaging is carried out to provide protection to the wafer or substrate. The casing (package) is built from materials such as plastic, metal, glass, or ceramic and contains one or more semiconductor electronic components. Semiconductor advanced packaging is a key component of the semiconductor manufacturing process. The package of a semiconductor device is usually made of materials such as plastic, metal, ceramic/glass. Packaging is undertaken to provide protection against impact and corrosion. It also has contact pins or leads used to connect external circuits to the device; the package also dissipates the heat produced in the device. Some of the advanced packaging technologies used in semiconductor device packaging are fan-out wafer-level packaging (FO WLP), flip-chip, fan-in wafer-level packaging (FI WLP), and 2.5D/3D.
Research Beam analysts forecast the global semiconductor advanced packaging market to grow at a CAGR of 8.45% during the period 2017-2021.
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Covered in this report
• The report covers the present scenario and the growth prospects of the global semiconductor advanced packaging market for 2017-2021. To calculate the market size, the report considers the sale of semiconductor capital equipment to end-use segments.
The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA
Research Beam report, Global Semiconductor Advanced Packaging Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors
• Advanced Semiconductor Engineering (ASE)
• Amkor Technology
• Samsung Semiconductor (SAMSUNG)
• TSMC (Taiwan Semiconductor Manufacturing Company)
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Other prominent vendors
• China Wafer Level CSP
• ChipMOS TECHNOLOGIES
• FlipChip International
• HANA Micron
• Interconnect Systems (Molex)
• Jiangsu Changjiang Electronics Technology (JCET)
• King Yuan Electronics
• Tongfu Microelectronics
• Nepes
• Powertech Technology (PTI)
• SIGNETICS
• Tianshui Huatian
• Ultratech
• UTAC
Market driver
• Complex semiconductor IC designs
• For a full, detailed list, view our report
Market challenge
• Rapid technological changes
• For a full, detailed list, view our report
Market trend
• Changes in wafer size
• For a full, detailed list, view our report
Key questions answered in this report
• What will the market size be in 2021 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
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Table of Contents
• PART 01: Executive summary
• PART 02: Scope of the report
• PART 03: Research Methodology
• PART 04: Introduction
• Market outline
• Semiconductor value chain
• PART 05: Technology landscape
• Back-end chip formation
• Wafer-level vs die-level packaging
• Roadmap of semiconductor packaging industry
• Ecosystem of semiconductor IC packaging industry
• PART 06: Market landscape
• Market overview
• Market size and forecast
• Five forces analysis
• PART 07: Segmentation by packaging technology
• Global semiconductor advanced packaging market by technology
• Flip-chip packaging
• FI WLP
• 2.5D/3D packaging
• FO WLP
• PART 08: Segmentation by device type
• Global semiconductor advanced packaging market by device type
• Analog and mixed ICs
• MEMS and sensors
• Logic and memory devices
• Wireless connectivity devices
• CMOS image sensors
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