Increasing Demand for Advanced Fabrication Tools in Nanotechnology Accelerates Opportunities for Atomic Layer Deposition (ALD) Equipment, reports TMR

The presence of a large number of international and local companies is boosting competition in the global atomic layer deposition (ALD) equipment market. As per a new study by Transparency Market Research (TMR), the competition prevailing in the market is expected to intensify further between 2016 and 2024. As of 2015, ASM International N.V., Applied Materials, Inc., and Tokyo Electron Ltd. cumulatively held a share of 58.9% in the global market. Of these, ASM International N.V. emerged as the top player, accounting for over 28% of the global ALD equipment market in 2015. Rivalry among key players in terms of product development and technology and product upgrades is expected to intensify during the forecast period.

“Due to the recent advancements in the atomic layer deposition technology, the use of ALD equipment has considerably increased in the nanotechnology sector,” says a lead analyst at TMR. TMR expects applications of ALD equipment as manipulation and fabrication tools in nanotechnology to rise further in the short term. “Growing concerns pertaining to carbon emissions have accelerated investment in the R&D of photovoltaics. Due to the increasing research and development activities, the use of ALD as a PV manufacturing method has substantially expanded,” adds the analyst. This rising demand for photovoltaic cells, combined with rapid advancements witnessed in PV technology, will subsequently augment sales of ALD equipment in the forthcoming years.

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Globally, electronic device components are being pushed towards micro spatially demanding structures. With the gradual movement towards the limit of Moore’s Law, several research and development (R&D) programs are ongoing in pushing the limit of Moore’s law. Thin film deposition techniques aid the semiconductor industry in performing the same. It is a process of creating a thin layer on top of a substrate or on top of another ‘thin film’. The thickness of the films can range between nanometers to micrometers. Thin film deposition is currently in very high demand and enormous amount of R&D is also ongoing to develop the process further. It is currently being used for various different applications, such as printed electronics, energy generation, optical coatings and energy storage among others. Thin film deposition process can be broadly divided in to Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD). Atomic Layer Deposition (ALD) is considered to be a type of CVD. Both CVD and PVD have various different techniques, advantages and disadvantages. Additionally, continuing technological advancements, has led to the possibility of deposition of different materials on required substrates.

Growing application of Atomic Layer Deposition (ALD) thin film coating techniques in the fabrication of a variety of electronic devices and components in the semiconductor industry is one of the major driving factors of the market. ALD technique can also be used to encapsulate devices against oxygen, moisture, and impurities in order to ensure long and failure-free operation. Apart from this, ALD has potential applications in industrial production processes which include biocompatible coatings for medical applications, solar cell efficiency enhancement, anti-tarnishing of coins and jewelry, and powder-based catalyst materials among others.

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Transparency Market Research (TMR) is a next-generation provider of syndicated research, customized research, and consulting services. TMR’s global and regional market intelligence coverage includes industries such as pharmaceutical, chemicals and materials, technology and media, food and beverages, and consumer goods, among others. Each TMR research report provides clients with a 360-degree view of the market with statistical forecasts, competitive landscape, detailed segmentation, key trends, and strategic recommendations.

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This release was published on openPR.