Global Back End of the Line Semiconductor Equipment Market Industry Analysis, Size, Share, Growth, Trends and Forecast 2016 - 2024

"The Report Back End of the Line Semiconductor Equipment Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2016 - 2024 provides information on pricing, market analysis, shares, forecast, and company profiles for key industry participants. - MarketResearchReports.biz"

​Back End of Line Semi-Conductor Equipment is the second part of semiconductor devices where single devices such as capacitors, transistors and resistors, among others are interconnected by wires on wafer which are made by pure silicon and metal layers to form required electrical circuits.

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Common metal that forms layers are aluminum interconnect and copper interconnect. Back end of the line in semiconductor equipments is started when the wafer gets deposited by the first layer of metal. Back end of line consists of metal levels, insulating layers (dielectrics), and bonding sites for chip to package connections. In back end of the line the formation of interconnect wires, contacts (pads), and dielectric structures takes place. Ten metal layers or more are added in back end of the line stage in semiconductor electronics. Steps of back end of line includes silicidation of the polysilicon region, drain regions and source, addition of dielectric and its processing, making holes in PMD in order to make contacts in them, adding the first metal layer, addition of second dielectric, connection of lower metal with higher metal by making vias through dielectric and passivation layer addition in order to protect the micro chip. Back end of the line semiconductor equipment market can be segmented by product type into CVD, coater developer, CMP, metal etching, PVD, wet station and stepper. The stepper market dominated the overall back end of the line semiconductor equipment market with more than 40% of the total market share in 2015. In terms of end-user, the global back end of the line semiconductor equipment market is segregated into memory, foundry and integrated device manufacturers (IDM). Foundry held the largest market share in 2015 and accounted close to 60% of the market share.

Major drivers driving the global back end of the line semi conductor equipments includes increasing demand for advanced packaging technologies and flip chips. With rising use of smart packaging technologies use of the same has also increased among consumers. In addition, increasing technological functionalities in mobile devices is a major driver driving the global back end of the line semi conductor equipments market. Increase in the number of advanced consumer electronic equipments is also a major driver driving the global market. Major restraints faced by the global back end of line semi conductor equipment market includes availability of few vendors in the global market which makes availability of the equipments a challenge and also increases cost. In addition, high investment by the end user is a major restraint towards market growth for companies in their initial stages. Proliferation of advanced semiconductor devices is acting as a big opportunity to the global back end of the line semi conductor equipment market. In addition, increased use of semiconductor memory devices also acts as a good opportunity of the global market. Growing application of IoT is also a major opportunity of the global back end of the line semiconductor equipment market.

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In terms of geography, the back end of the line semiconductor equipments global market is segregated into North America, Europe, Asia Pacific, Middle East and Africa and Latin America. Asia Pacific is the largest market accounting to more than 50% of the market share of the back end of the line semiconductor equipment global market. With the presence of large number of manufacturers in China, Japan, South Korea and Taiwan is the major region of dominance of this region in the global back end of the line semiconductor equipment market.

Major players of the global back end of the line semiconductor equipments include Applied Materials (California, U.S), ASML (Veldhoven, Netherlands), KLA-Tencor (California, U.S), Lam Research (California, U.S), Dainippon Screen Mfg. Co., Ltd. (Kyoto, Japan), Hitachi Global (Tokyo, Japan), Nikon Corporation (Tokyo, Japan) and Tokyo Electron Limited (TEL) (Tokyo, Japan) among others.
The report offers a comprehensive evaluation of the market. It does so via in-depth qualitative insights, historical data, and verifiable projections about market size. The projections featured in the report have been derived using proven research methodologies and assumptions. By doing so, the research report serves as a repository of analysis and information for every facet of the market, including but not limited to: Regional markets, technology, types, and applications.

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The study is a source of reliable data on:
Market segments and sub-segments
Market trends and dynamics
Supply and demand
Market size
Current trends/opportunities/challenges
Competitive landscape
Technological breakthroughs
Value chain and stakeholder analysis
The regional analysis covers:
North America (U.S. and Canada)
Latin America (Mexico, Brazil, Peru, Chile, and others)
Western Europe (Germany, U.K., France, Spain, Italy, Nordic countries, Belgium, Netherlands, and Luxembourg)
Eastern Europe (Poland and Russia)
Asia Pacific (China, India, Japan, ASEAN, Australia, and New Zealand)
Middle East and Africa (GCC, Southern Africa, and North Africa)

The report has been compiled through extensive primary research (through interviews, surveys, and observations of seasoned analysts) and secondary research (which entails reputable paid sources, trade journals, and industry body databases). The report also features a complete qualitative and quantitative assessment by analyzing data gathered from industry analysts and market participants across key points in the industry’s value chain.
A separate analysis of prevailing trends in the parent market, macro- and micro-economic indicators, and regulations and mandates is included under the purview of the study. By doing so, the report projects the attractiveness of each major segment over the forecast period.

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Highlights of the report:
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Important changes in market dynamics
Market segmentation up to the second or third level
Historical, current, and projected size of the market from the standpoint of both value and volume
Reporting and evaluation of recent industry developments
Market shares and strategies of key players
Emerging niche segments and regional markets
An objective assessment of the trajectory of the market
Recommendations to companies for strengthening their foothold in the market

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